? semiconductor components industries, llc, 201 1 november , 201 1 ? rev . 7 1 publication order number: nud4001/d nud4001, NSVD4001 high curr ent led driver this device is designed to replace discrete solutions for driving leds in low voltage ac ? dc applications 5.0 v , 12 v or 24 v . an external resistor allows the circuit designer to set the drive current for dif ferent led arrays. this discrete integration technology eliminates individual components by combining them into a single package, which results in a significant reduction of both system cost and board space. the device is a small surface mount package (so?8). features ? supplies constant led current for v arying input v oltages ? external resistor allows designer to set current ? up to 500 ma ? of fered in surface mount package t echnology (so ? 8) ? aec ? q101 qualified and pp ap capable ? nsv prefix for automotive and other applications requiring unique site and control change requirements ? pb ? free package is a vailable benefits ? maintains a constant light output during battery drain ? one device can be used for many dif ferent led products ? reduces board space and component count ? simplifies circuit and system designs t ypical applications ? portables: for battery back ? up applications, also simple ni ? cad battery char ging ? industrial: low v oltage lighting applications and small appliances ? automotive: t ail lights, directional lights, back ? up light, dome light pin function description pin symbol description 1 v in positive input voltage to the device 2 boost this pin may be used to drive an external transistor as described in the app note and8198/d. 3 r ext an external resistor between r ext and v in pins sets dif ferent current levels for dif ferent application needs 4 gnd ground 5, 6, 7, 8 i out the leds are connected from these pins to ground http://onsemi.com device package shipping ? ordering informa tion nud4001dr2 so ? 8 2500 / t ape & reel so ? 8 case 751 style 25 pin configura tion and schema tic 1 8 r ext gnd v in i out i out i out current set point 4001 = specific device code a = assembly location y = y ear ww = w ork w eek = pb ? free device marking diagram boost i out ? for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification brochure, brd801 1/d. 1 2 3 4 8 7 6 5 nud4001dr2g so ? 8 (pb ? free) 2500 / t ape & reel 4001 a yww 1 8 NSVD4001dr2g so ? 8 (pb ? free) 2500 / t ape & reel pdf create 8 trial www.nuance.com http://
nud4001, NSVD4001 http://onsemi.com 2 maximum ra tings (t a = 25 c unless otherwise noted) rating symbol value unit continuous input voltage v in 30 v non ? repetitive peak input voltage (t 1.0 ms) v p 60 v output current (for v drop 2.2 v) (note 1) i out 500 ma output voltage v out 28 v human body model (hbm) esd 1000 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only . functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability . 1. v drop = v in ? 0.7 v ? v leds . thermal characteristics characteristic symbol value unit operating ambient temperature t a ? 40 to +125 c maximum junction temperature t j 150 c storage temperature t stg ? 55 to +150 c t otal power dissipation (note 2) derating above 25 c (figure 3) p d 1.13 9.0 w mw/ c thermal resistance, junction?to?ambient (note 2) r ja 110 c/w thermal resistance, junction?to?lead (note 2) r jl 77 c/w 2. mounted on fr ? 4 board, 2 in sq pad, 2 oz coverage. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit output current1 (v in = 12 v, r ext = 2.0 , v leds = 10 v) i out1 305 325 345 ma output current2 (v in = 30 v, r ext = 7.0 , v leds = 24 v) i out2 95 105 115 ma bias current (v in = 12 v, r ext = open, v leds = 10 v) i bias ? 5.0 8.0 ma voltage overhead (note 3) v over 1.4 ? ? v 3. v over = v in ? v leds . pdf create 8 trial www.nuance.com
nud4001, NSVD4001 http://onsemi.com 3 typical performance cur ves (t a = 25 c unless otherwise noted) r ext , i out (ma) figure 1. output current (i out ) vs. external resistor (r ext ) 1 10 100 1000 1 10 1000 100 p d , power dissip a tion (w) t a , ambient tempera ture ( c) 0.000 0.200 0.400 0.600 0.800 1.000 1.200 25 35 45 55 65 75 85 95 105 1 15 125 0.6 ? 40 ? 10 20 50 80 1 10 155 t j , junction tempera ture ( c) figure 2. v sense vs. junction t emperature v sense (v) figure 3. t otal power dissipation (p d ) vs. ambient t emperature (t a ) 0.000 0.050 0.100 0.150 0.200 0.250 0.300 0.350 0.400 0.450 0.500 05 10 15 20 25 30 p d_control (w) v in (v) figure 4. internal circuit power dissipation vs. input v oltage figure 5. current regulation vs. junction t emperature 0.5 0.4 0.3 0.2 0.1 0.0 0.9 0.8 0.7 ? 25 5 35 65 95 125 140 1.2 ? 40 ? 10 20 50 80 1 10 155 t j , junction tempera ture ( c) output current , normalized 1.0 0.8 0.6 0.4 0.2 0.0 ? 25 5 35 65 95 125 140 pdf create 8 trial www.nuance.com
nud4001, NSVD4001 http://onsemi.com 4 applica tion informa tion design guide 1. define led? s current: a. i led = 350 ma 2. calculate resistor v alue for r ext : a. r ext = v sense (see figure 2) / i led b. r ext = 0.7 (t j = 25 c)/ 0.350 = 2.0 3. define v in : a. per example in figure 6, v in = 12 v 4. define v led @ i led per led supplier ? s data sheet: a. per example in figure 6, v led = 3.5 v + 3.5 v + 3.5 v = 10.5 v figure 6. 12 v application (series led? s array) r ext gnd v in i out current set point nud4001 boost i out 12 v i out i out 1 2 3 4 8 7 6 5 5. calculate v drop across the nud4001 device: a. v drop = v in ? v sense ? v led b. v drop = 12 v ? 0.7 v (t j = 25 c) ? 10.5 v c. v drop = 0.8 v 6. calculate power dissipation on the nud4001 device? s driver: a. p d_driver = v drop * i out b. p d_driver = 0.8 v x 0.350 a c. p d_driver = 0.280 w atts 7. establish power dissipation on the nud4001 device? s control circuit per figure 4: a. p d_control = figure 4, for 12 v input voltage b. p d_control = 0.055 w 8. calculate t otal power dissipation on the device: a. p d_total = p d_driver + p d_control b. p d_total = 0.280 w + 0.055 w = 0.335 w 9. if p d_total > 1.13 w (or derated value per figure 3), then select the most appropriate recourse and repeat steps 1 through 8: a. reduce v in b. reconfigure led array to reduce v drop c. reduce i out by increasing r ext d. use external resistors or parallel device? s configuration (see application note and8156) 10. calculate the junction temperaure using the thermal information on page 7 and refer to figure 5 to check the output current drop due to the calculated junction temperature. if desired, compensate it by adjusting the value of r ext . pdf create 8 trial www.nuance.com
nud4001, NSVD4001 http://onsemi.com 5 typical applica tion circuits figure 7. stop light automotive circuit using the nud4001 device to drive one high current led (550 ma). v bat 13.5 vdc + ? 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 d1 1n4004 r1 2.7 , 1/4 w r2 32 , 5.0 w r4 32 , 5.0 w r3 2.7 , 1/4 w r3 6.7 , 4.0 w led1 luxeon emitter 550 ma nud4001 nud4001 q1 q2 0 figure 8. dome light automotive circuit using the nud4001 device to drive one led (220 ma). v bat 13.5 vdc + ? 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 d1 1n4004 r1 7.0 , 1/4 w r2 7.0 , 1/4 w r3 27 , 2.0 w led1 luxeon emitter 220 ma nud4001 nud4001 q1 q2 0 pdf create 8 trial www.nuance.com
nud4001, NSVD4001 http://onsemi.com 6 figure 9. nud4001 device configuration for pwm v bat 12 vdc + ? 1 2 3 4 8 7 6 5 led1 lxhl ? mw1d nud4001 q1 0 r ext1 2.0 , 1/4 w r ext2 110 k, 1/4 w led2 lxhl ? mw1d led3 lxhl ? mw1d pwm q2 2n2222 figure 10. 12 vac landscape lighting application circuit using the nud4001 device to drive three 350 ma leds. 1 2 3 4 8 7 6 5 d1 mura105t3 r2 2.0 , 1/4 w led3 luxeon emitter 350 ma nud4001 q2 0 d2 mura105t3 d3 mura105t3 d4 mura105t3 c1 220 f 12 v ac from: 60 hz transformer or electronic transformer led1 luxeon emitter 350 ma led2 luxeon emitter 350 ma pdf create 8 trial www.nuance.com
nud4001, NSVD4001 http://onsemi.com 7 thermal informa tion nud4001, NSVD4001 power dissipation the power dissipation of the so ? 8 is a function of the pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r ja , the thermal resistance from the device junction to ambient, and the operating temperature, t a . using the values provided on the data sheet for the so ? 8 package, p d can be calculated as follows: p d t jm a x t a r ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into t h e equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 1.13 w . p d 150 c 25 c 110 c 1.13 w the 11 0 c/w for the so ? 8 package assumes the use of a fr ? 4 copper board with an area of 2 square inches with 2 oz coverage t o achieve a power dissipation of 1.13 w . there are other alternatives to achieving higher dissipation from the soic package. one of them is to increase the copper area to reduce the thermal resistance. figure 1 1 shows how the thermal resistance changes for dif ferent copper areas. another alternative would be to use a ceramic substrate or an aluminum core board such as thermal clad ? . using a board material such as thermal clad or an aluminum core board, the power dissipation can be even doubled using the same footprint. 60 80 100 120 140 160 180 0 1 23 4 5 678 9 10 board area (in 2 ) ja ( c/w) figure 1 1 . ja versus board area 0 50 100 150 200 250 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 100 0 r( ) (c /w) time (sec) 1s ? 36.9 sq. mm ? 0.057 in sq. 1s ? 75.8 sq. mm ? 0.1 17 in sq. 1s ? 150.0 sq. mm ? 0.233 in sq. 1s ? 321.5 sq. mm ? 0.498 in sq. 1s ? 681.0 sq. mm ? 1.056 in sq. 1s ? 1255.0 sq. mm ? 1.945 in sq. figure 12. t ransient thermal response pdf create 8 trial www.nuance.com
nud4001, NSVD4001 http://onsemi.com 8 p ackage dimensions soic ? 8 n b case 751 ? 07 issue ak seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and t olerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allow able dambar protrusion shall be 0.127 (0.005) t ot al in excess of the d dimension at maximum ma terial condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new st andard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting t e chniques reference manual, solderrm/d. soldering footprint* style 25: pin 1. vin 2. n/c 3. rext 4. gnd 5. iout 6. iout 7. iout 8. iout on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice t o any products herein. scillc makes no warranty , representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including wi thout limitation special, consequential or incidental damages. ?t ypical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in dif ferent application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer ?s technical experts. scillc does not convey any license under its patent rights n o r the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur . should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publica tion ordering informa tion n. american t echnical support : 800 ? 282 ? 9855 t oll free usa/canada europe, middle east and africa t echnical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nud4001/d thermal clad is a registered trademark of the bergquist company . litera ture fulfillment : literature distribution center for on semiconductor p .o. box 5163, denver , colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 t oll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 t oll free usa/canada email : orderlit@onsemi.com on semiconductor website : www .onsemi.com order literature : http://www .onsemi.com/orderlit for additional information, please contact your local sales representative pdf create 8 trial www.nuance.com
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